Today’s machines can “think”. More than thirty years ago, this was only a dream. Now it has become a reality, made possible by a revolution in the field of semiconductors. Semiconductors and sensors help to provide precise control of all types of machines, from automotive engines to machine tools, allowing them to make continuous adjustments through the acquisition, analysis, and control of environmental data. But the semiconductor “brain” cannot do all this alone. It needs a housing that can act as the interface to the machine.
Hybrid frames have their application here. These frames act as an interface for integrated electronics that transfer both: signals and energy. The signal transfer is accomplished through aluminum or gold wire bonding. The hybrid frame also houses selectively plated, custom connectors, that enable the completion of the signal transfer. DODUCO is a market leader in hybrid frame engineering, especially for automotive applications. We are the largest European source for cladded aluminum, the preferred surface for aluminum wire bonding. We also offer a variety of other plated and clad surfaces such as silver, nickel, gold palladium and tin.
Through decades of experience in the manufacture of hybrid frames, DODUCO can offer outstanding applications advice in the selection of the most suitable contact surfaces and surface treatments. Additionally, our product development engineers will custom design a process to support our customers in all phases of hybrid frame construction, resulting in the highest quality hybrid frames at a favorable cost.
From design consultation, to development and production, DODUCO provides its customers with a complete capability package for hybrid frames, used to provide energy for machines and equipment.